DeepMaterial DM-6180 low temperature curing adhesive, fast curing at low temperature, used for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sensitive applications that require... low-temperature curing. It can quickly provide customers with high-throughput applications, such as attaching light diffusion lenses to LEDs, and assembling image sens
DeepMaterial DM-6180 low temperature curing adhesivefast curing at low temperatureused for the assembly of CCD or CMOS components and VCM motors. This product is specifically designed for heat-sen
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