This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
Contact information
Low temperature curing epoxy adhesive
Huizhou City, Guangdong,China
Quality assurance is the top priority of ProvenExpert's terms of use and evaluation guidelines.
However, should you feel that a review is in violation of our guidelines, you can submit a request to have the review assessed by the ProvenExpert quality assurance team by using the following contact form.
Send email to reviewer
* Required fields
You have already posted this review on . Posting again might create duplication.
Continue?